Moisture desorption characteristics of the laminate.Desired level of moisture content after the bake.
Requirements relating to the time and temperature are dependent on many factors. It is a recommendation which may vary depending on the relative humidity. In the IPC-1601A you will find a table that will help you with the time and temperature baking profiles you will have to develop. Within one hour after any baking, parts shall be stored at less than 10% RH, or dry packed in a MBB.
Once the PCB's are more than 5 days left out of the dry storage, they shall be baked for moisture removal prior to packaging. The oven for baking the PCB should have a relative humidity below the 5% rh. In this standard you will find most answers about baking, so in this article we will help you with some important considerations you have to make. The standard is called the IPC-1601A (Printed Board Handling and Storage Guidelines). To start with, IPC has developed a standard for handling and Storage PCB's. In this article I will help you as good as possible. If you have any of this questions, then this article is something for you. Often we get the questions: 'Is baking PCB's a myth?', 'At what temperature do we bake the PCB's?' and 'Is there a correct method?'.
